Modular networked sensor assembly

ABSTRACT

In a network sensor assembly, network environmental monitor, and associated fabrication methods, a network sensor assembly comprises a panel configured for mounting on a surface, a plurality of addressable sensors coupled to the panel that sense environmental conditions at the surface, a memory device that stores configuration information associated with the plurality of addressable sensors, and a bus. The bus is communicatively coupled to the plurality of addressable sensors and the memory device and is configured for communicatively coupling the network sensor assembly to a network node for communicating data associated with the sensed environmental conditions in a network.

BACKGROUND

1. Field of the Invention

A sensor system is operable to monitor environmental conditions within adata center.

2. Related Art

A data center may be defined as a location, e.g., a room that housesnumerous printed circuit (PC) board electronic systems arranged in anumber of racks. A standard rack may be defined as an ElectronicsIndustry Association (EIA) enclosure, 78 in. (2 meters) high, 24 in.(0.61 meter) wide and 30 in. (0.76 meter) deep. Standard racks may beconfigured to house a number of PC boards, e.g., about forty (40) PCserver systems, with some existing configurations of racks beingdesigned to accommodate up to 280 blade systems. The PC boards typicallyinclude a number of components, e.g. processors, micro-controllers, highspeed video cards, memories, and the like, that dissipate relativelysignificant amounts of heat during the operating of the respectivecomponents. For example, a typical PC board comprising multiplemicroprocessors may dissipate approximately 250 W of power. Thus, a rackcontaining forty (40) PC boards of this type may dissipate approximately10 KW of power.

The power required to remove the heat dissipated by the components inthe racks is generally equal to about 10 percent of the power needed tooperate the components. However, the power required to remove the heatdissipated by a plurality of racks in a data center is generally equalto about 50 percent of the power needed to operate the components in theracks. The disparity in the amount of power required to dissipate thevarious heat loads between racks and data centers stems from, forexample, the additional thermodynamic processing needed in the datacenter to cool the air.

Equipment or computer racks are typically cooled in bulk with fans thatmove cooling fluid, e.g., air, across the heat dissipating components.Additionally, data centers often implement reverse power cycles to coolheated return air. The additional work required to achieve thetemperature reduction, in addition to the work associated with movingthe cooling fluid in the data center and the condenser, often add up tothe 50 percent power requirement. As such, the cooling of data centerspresents problems in addition to those faced with the cooling of racks.

Conventional data centers are typically cooled by operation of one ormore air conditioning units. The compressors of the air conditioningunits typically require a minimum of about thirty (30) percent of therequired cooling capacity to sufficiently cool the data centers. Theother components, e.g., condensers, air movers (fans), etc., typicallyrequire an additional twenty (20) percent of the required coolingcapacity. As an example, a high density data center with 100 racks, eachrack having a maximum power dissipation of 10 KW, generally requires 1MW of cooling capacity.

Air conditioning units with a capacity of 1 MW of heat removal generallyrequire a minimum of 30 KW input compressor power in addition to thepower needed to drive the air moving devices, e.g., fans, blowers, etc.Conventional data center air conditioning units do not vary theircooling output based on the distributed needs of the data center.Instead, these air conditioning units generally operate at or near amaximum compressor power even when the heat load is reduced inside thedata center.

The substantially continuous operation of the air conditioning units isgenerally designed to operate according to a worst-case scenario.Cooling is supplied to the components at around 100 percent of theestimated cooling requirement. In this respect, conventional coolingsystems often attempt to cool components that may not need to be cooled.Consequently, conventional cooling systems often incur greater amountsof operating expenses than may be necessary to sufficiently cool theheat generating components by continuously supplying 100 percent of theworst case estimated cooling requirement.

SUMMARY

In various embodiments, a network sensor assembly, network environmentalmonitor, and associated fabrication methods, a network sensor assemblycomprises a panel configured for mounting on a surface, a plurality ofaddressable sensors coupled to the panel that sense environmentalconditions at the surface, a memory device that stores configurationinformation associated with the plurality of addressable sensors, and abus. The bus is communicatively coupled to the plurality of addressablesensors and the memory device and is configured for communicativelycoupling the network sensor assembly to a network node for communicatingdata associated with the sensed environmental conditions in a network.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention and theadvantages thereof, reference is now made to the following descriptionof embodiments of the invention taken in conjunction with theaccompanying drawings in which like reference numerals indicate likefeatures and wherein:

FIG. 1 is a diagram of a partially assembled modular sensory assembly inaccordance with an embodiment of the invention.

FIG. 2 is a diagram of a modular sensory assembly in accordance with asecond embodiment of the invention.

FIG. 3 is a diagram of the modular sensory assembly of FIG. 1 foldedalong a central foldline in accordance with an embodiment of theinvention.

FIG. 4A is a cross-section of a modular sensory assembly in accordancewith an embodiment of the invention.

FIG. 4B is a cross-section of a second modular sensory assembly thatincorporates cushioning materials within the structure in accordancewith an embodiment of the invention.

FIG. 5 is a side view a modular sensory assembly attached to a computeror equipment rack in accordance with an embodiment of the invention.

FIG. 6 is a front view a modular sensory assembly attached to a computeror equipment rack in accordance with an embodiment of the invention.

FIG. 7 is a front perspective view of one embodiment of an electronicsrack configured with a sensor assembly in accordance with an embodimentof the invention.

FIG. 8 is a rear perspective view of one embodiment of an electronicsrack configured with a sensor assembly in accordance with an embodimentof the invention.

FIG. 9 is a logic flow diagram in accordance with an embodiment of theinvention.

FIG. 10 is a schematic illustration of a rack system provided withsensors in accordance with an embodiment of the invention.

FIG. 11 shows a sensor connection scheme that can be implemented usingthe sensor assembly shown herein in accordance with an embodiment of theinvention.

DETAILED DESCRIPTION

Reference will now be made to the exemplary embodiments illustrated inthe drawings, and specific language will be used herein to describe thesame. It will nevertheless be understood that no limitation of the scopeof the invention is thereby intended. Alterations and furthermodifications of the inventive features illustrated herein, andadditional applications of the principles of the invention asillustrated herein, which would occur to one skilled in the relevant artand having possession of this disclosure, are to be considered withinthe scope of the invention.

It has now been discovered a need exists to develop a distributednetwork of sensors that is simple to install on new or existingequipment rack systems, and that provides a low cost sensor assembly fordeploying multiple sensors over a widely distributed area.

FIG. 1 depicts an embodiment of sensor assembly 10. Sensor assembly 10includes flexible body 12, a number of sensors 14, memory device 16,common bus 18, and data connector 20. Flexible body 12 further includesa number of mounting tabs 22 and sensor tabs 26. Flexible body 12 may befolded along fold line 24, which divides flexible body 12 into firstpanel 28 and second panel 30. Sensor tabs 26 are formed from cutoutswithin the flexible body and are located proximate to sensors 14.Mounting tabs 22 hingedly attach to flexible body 12 at fold lines 32.In one embodiment, the mounting tabs may mechanically couple flexiblebody 12 to the front panel of an equipment rack with pop rivets,adhesive, mechanical fasteners, or other like fastening systems known tothose skilled in the art.

Sensors 14 may sense or monitor various environmental conditions. Theseconditions include temperature, pressure, humidity, air velocity, smokesensors, airborne particulate, hazardous gasses, occupancy sensors,equipment door condition, sound, light, ultraviolet, electromagneticenergy or other like conditions known to those skilled in the art. Thiswide variety of sensors allows equipment or materials stored in themonitored environment to be operated/stored as allowed by theenvironmental conditions. Alternatively, the environmental conditionsmay be adjusted based on this information. Although one embodimentaddresses the operation of HVAC to support rack mounted equipment, thesesensors may be applied to monitor and control environmental conditionsof perishable items such as food and medicine, incubators, climatecontrolled archives (i.e., for rare first edition publications) or otherlike uses known to those having skill in the art.

Sensors 14 and memory device 16 communicatively couple to common bus 18.As shown in FIG. 1, common bus 18 may be a ribbon wire having twoconductors, 36 and 38. Sensors 14 sense environmental conditions suchas, but not limited to, temperature, humidity, air pressure, airvelocity, smoke sensors, occupancy sensors, rack door condition, sound,and light. Common bus 18 couples to conductor wire 34, such as, but notlimited to, a flat phone-type wire that extends from one end of commonbus 18 and terminates in data connector 20. As shown, data connector 20may be a telephone-type modular connector that allows the connector wireto be interconnected to a computer network so that the data, such astemperature, humidity, air pressure, etc., can be communicated from thesensors to the network. The sensor assembly can be substantiallycontinuous, as shown in FIG. 1 or may include multiple segments that areinterconnected by an intermediate connector wire 40, as shown in FIG. 2.

FIG. 3 depicts network sensor assembly 10 wherein first panel 28 hasbeen folded over onto second panel 30. This clearly shows that sensortabs 26, as cut out from first panel 28, are positioned to providesupport to sensors 14. In this way, sensor tabs 26 can support andprotect sensors 14 from inadvertent disorientation or damage.

FIG. 4A provides a cross-section of network assembly 10. Here, it isshown that common bus 18 is located in between first panel 28 and secondpanel 30. Common bus 18 may be secured with adhesive 42 to form a layeron either side of conductor tape 18. A release liner, not shown, may beinitially on ribbon tape used as common bus 18 wherein the release lineris removed to secure the ribbon tape to the flexible body. In such anexample, common bus 18 would first be secured to panel 30, and oncepanel 28 had been folded over panel 30, the second release liner may beremoved in order to mechanically couple the ribbon wire to the secondpanel. Folding panel 28 onto panel 30 results in a peaked roof, bendingat a point. Sensor tabs 26 continue from the panels in a straight line.As shown, sensor 14 is coupled to the ribbon wire with leads 48. Leads48 couple sensor 14 to the conductor wire, and may establish electricalcontact electrically coupling (i.e., soldering, crimping, welds,conductive adhesive, or other like means known to those having skill inthe art) individual leads 48 to flat conductors 38 and 36 within theribbon wire of the common bus. Push rivets 44 or other like mechanicalfastener may be used to secure mounting tabs 22 to the computer rack aswill be discussed further in FIGS. 5 and 6.

FIGS. 4A and 4B shows the internal structure of sensor assembly 10.Sensor assembly 10 generally includes several layers of materiallaminated together to form a rugged but flexible assembly. Sensorassembly 10 includes outer walls (first panel 28 and second panel 30 offlexible body 12), to which the other components are attached. In oneembodiment, flexible body 12 can be a 0.010″ thick plastic strip 0.75″wide.

Rugged plastic tape may also be used as adhesive layer 42 to securecommon bus 18. Common bus 18 may be conductive tape wire, such as copperfoil tape with an adhesive backing. Conductive foil or flex circuit tapecan be used, such as copper tape foil CK1017 from Cir-Kit Concepts Inc.While two flat conductors 36 and 38 are shown in the depictedembodiment, the sensor assembly is not limited to two, for reasons thatare discussed below. In one embodiment, conductors 36 and 38 represent adata line and ground line.

Sensor 14 is electrically coupled to conductors 36 and 38 via leads 48.Each sensor 14 includes at least two leads 48. One lead serves as a dataconnection lead while the other lead serves as a ground connection lead.The data connection lead connects the sensor to computer controller 110,shown in FIG. 6. The ground connection lead and the data connection leadcan be configured either in one long wire pair, as shown, with multiplesensors in parallel. There are a variety of sensor types and sensorproducts that can be used. One type of temperature sensor that mayemploy is a Dallas Semiconductor/Maxim integrated circuits DS18S20-PARsensor. The sensor assembly can also be used to deploy other digitaltransducers or sensors with similar connectivity requirements butdiffering functionalities, such as transducers and sensors for detectingfluid (air) pressure, fluid velocity, humidity, occupancy, light, smoke,door condition, etc. Multiple or redundant conductor assemblies can bedeveloped to address connectivity requirements of a wide variety oftransducers and provide customization (or upgrades). The sensor assemblycan also be used beyond the rack assembly, for other non-rack relatedsensors like pressure transducers inside a plenum or temperature sensorsfor vents.

Power for the sensor 14 may be parasitically drawn from the data line.Specifically, the sensor may include an internal capacitor, which drawspower and charges during data line inactivity. Alternatively, a sensorwithout an internal capacitor could be used. Such a sensor could includethree leads, one of which would be connected to a power supply line (notshown) that would be separate from the data and ground lines. Thus, sucha system would require a third conductor line, in addition to the dataline and ground line shown in the FIGs.

In the embodiment shown, sensor 14 is configured to measure ambienttemperature a small distance, (for example one implementation uses 15mm) from sensor assembly 10, and convert the temperature reading into adigital signal. One advantage of implementing this type of sensor isthat a central instrument is not needed. Each sensor is capable ofindependently converting physical temperature data to transmittabledigital data. This eliminates the need to carry sensitive analog signalsfrom point to point. The digital data provided by the sensor can beprotected by cyclic redundancy check (CRC) algorithms that preventdistortion of the data.

Common bus 18 is a multiple conductor wire. As shown, the ribbon wireused as common bus 18 includes two conductors 36 and 38, the ends ofwhich are electrically coupled to the ends of leads 48 to provideconnectivity to the sensors. One conductor is the data line, and theother conductor is the ground line. Where sensors 14 include more thantwo leads, the common bus will also include more than two correspondingconductors.

Memory device 16 is configured to contain configuration andidentification information related to sensors 14 that are attached tosensor assembly 10. Memory device 16 may be a single memory device or aplurality of memory devices. Such a memory device may be a read-onlymemory, random access memory, volatile memory, non-volatile memory,static memory, dynamic memory, flash memory, cache memory, and/or anydevice that stores digital information. In one embodiment, memory device14 can be an EEPROM device that includes a memory table with theidentification information for each sensor. Specifically, in oneembodiment, each Dallas Semiconductor DS18S20-PAR sensor has a uniquefactory-assigned 64 bit identification code or address. The memorydevice can be configured to retain in memory the addresses of eachsensor disposed downstream, so as to speed the collection of data. Thisconfiguration advantageously provides a two-conductor physical interfacewith a large address space.

Alternatively, the identification of each sensor 14 can be prescribedwith a much smaller address, such as that used by I2C devices. However,this configuration requires at least four conductors on the sensorassembly, and also requires wiring (e.g. printed circuits) with passivecomponents at each sensor for retaining address settings. Alternatively,a user-defined identification code for each sensor (rather than afactory-assigned code) can be prescribed and recorded in memory device16, the memory device being factory-set with the user-definedidentification codes. As provided by yet another alternative, aprocessor within the network node or central computer 110 of FIG. 10 canbe programmed with each sensor address in order to accurately collectand interpret the sensor data.

Sensor assembly 10 may include a number of other features forruggedness, durability, and convenience. For example, a first protectivecover, such as a section of shrink tubing, may cover leads 48 of sensor14. A second protective cover, such as shrink tubing, may be used tosubstantially cover the sensor, leaving a small portion of the sensorprotruding. A small piece of cushioning material, such as ⅛″ thickdouble faced foam tape, may be positioned about the second protectivecover around sensor 14, and a similar piece of cushioning material maybe provided around common bus 18 and memory device 16. These protectivecovers, cushioning material, sensor tabs 26 and similar features serveas strain relief and protective coverings for the various components,helping to prevent damage to sensors 14, memory device 16, common bus18, and related electrical connections. The functions of these featuresmay be performed by alternate means known to those skilled in the art.An adhesive or adhesive layer, such as thin double-sided adhesive tape(not shown), can be applied to the exterior sides of common bus 18 tosecure the first panel 28, second panel 30 and common bus 18 betweenoptional sections of cushioning material 45.

Sensor assembly 10 may be positioned within a molding or other elongateprotective structure, such as a channel. This channel may includemultiple openings to allow individual sensors 14 of the sensor assemblyto protrude through to the outer environment. The molding or channel tobe discussed further with reference to FIGS. 7 and 8, may be ofaluminum, plastic, or any other suitable material. The molding canprovide a decorative trim piece for the equipment rack, and can beconfigured to attach to the inside or outside of the rack.

Other configurations and materials can also be used for the sensorassembly. For example, flexible body 12 may be formed from a semi-rigidmaterial that can be adhered directly to a continuous layer 45 ofinternal cushioning material. Flexible body 12 can be made from plastic,aluminum, or other material comprising a decorative molding or trimpiece. Integral snap rivet 44 accommodates mounting of the sensorassembly to computer rack 60.

FIG. 5 shows a cross-section of exterior panel 46 of a computer rackwherein network assembly 10 is mounted onto the exterior panel of thecomputer rack. Push rivets 44 pass through openings on mounting tabs 22to secure sensor assembly 10 to exterior panel 46 of the computer rack.FIG. 6 provides a front view that shows computer rack 60 having exteriorpanel 46 wherein sensor assembly 10 is mounted with a low profile onexterior panel 46. This low profile reduces any obstruction to airflowwithin computer rack 60 caused by the sensor assembly 10.

Depicted in FIGS. 7 and 8 are front and rear perspective views of oneembodiment of an electronics rack 60 configured with sensor assemblies10. There are a variety of equipment racks that are commerciallyavailable, and the application of the sensor assembly is not limited tocompatibility with just one variety. The rack can be configured invarious ways, and is not limited to the configuration shown. The rackshown in the drawings generally comprises upright body 62, with accessdoor 64 on its front and a pair of access doors 66 on the back. Thefront and rear doors include a screen, mesh, or perforated panel such asthe exterior panel discussed with reference to FIGS. 5 and 6 that allowsair to flow through the panel while allowing users to view componentsand hardware inside.

Computer rack 60 houses a plurality of components 70, e.g., processors,micro-controllers, high speed video cards, memories, semi-conductordevices, and the like. The components may be elements of a plurality ofsubsystems (not shown), e.g., computers, servers, etc. In theperformance of their electronic functions, the components, and thereforethe subsystems, generally dissipate relatively large amounts of heat.Because computer rack systems have been generally known to includeupwards of forty (40) or more subsystems, the computer racks oftenrequire substantial amounts of cooling to maintain the subsystems andthe components generally within a predetermined operating temperaturerange. Additionally, the temperature of cooling air supplied by a datacenter cooling system is likely to vary based on distance between thecooling equipment and the computer rack. Accordingly, temperaturereadings associated with the operation of the computer rack are gatheredat multiple points in the vertical and horizontal directions.

Sensor assembly 10 can be configured to fit onto installation featuresbuilt into computer rack 60. For example, the front sensor assembly 10A,shown in FIG. 7 is a continuous sensor assembly installed on acosmetically pleasing trim strip 61 mounted on perforated panel 68 offront door 64 of computer rack 60. Sensor assembly 10 includes threesensors 14, for obtaining a measurement of inlet air temperature fromnear the bottom to the top of the rack. If the rack does not include afront door, sensor assembly 10 can be installed on or in trim strip 61at an edge of the front of computer rack 60.

As shown in FIG. 8, rear sensor assembly 10B can be designed to mountwithin the rear cavity of computer rack 60, inside one of rear doors 66.Alternatively, sensor assembly 10 could be configured to mount on therear mounting channels. Cosmetic appearance is not as important in therear of computer rack 60, but mounting flexibility is. There aretypically many obstructions in this area, and mounting of a continuoussensor assembly may be difficult. For this reason, rear sensor assembly10B shown is configured like that of FIG. 2, comprising more than onesensor sections 41, interconnected by flexible connector wire 40. Theflat sensor sections make installation simple, and intermediateconnector wire 40 provides for routing around obstacles, such as thecross bar of the rack door, etc.

It is also notable that the rear sensor assembly 10B includes anoverhead sensor positioned to extend above computer rack 60. Thisconfiguration can be accommodated in various ways. For example, wherethe sensor assembly is disposed inside rear doors 66, the overheadportion of the sensor assembly can be a discontinuous portion that isconnected to the remainder of the assembly via a connector wire. Thiswire can extend unobtrusively between adjacent door 66 and the body ofcomputer rack 60. The overhead portion of the sensor assembly can beattached to additional support structure, such as an upright rodassociated with computer rack 60. Alternatively, the overhead portion ofthe sensor assembly may include a support member. Other configurationsare also possible to provide for overhead sensors.

Sensor assemblies 10 are designed to facilitate easy mounting on anequipment or computer rack, either at the factory before shipment to thecustomer, or at the customer site for installation as an option. This isaccomplished by building mounting features into the equipment rackoperable to accommodate sensor assemblies 10. These features can be inthe form of a channel or series of holes in the surface of the rack(designed to receive snap rivets 44 or other like connectors), and aredesigned to fit mounting provisions on the rack. When a sensor assemblyis not installed at a given location that is configured to receive one,a compatible blank trimming strip can be installed at that location tocover the exposed mounting locations. In this way a cosmeticallyappealing appearance can be maintained whether or not the sensorassembly is installed.

Mounting point features designed into equipment racks facilitateinstallation of sensor assembly 10. The sensor assemblies may also beretrofitted onto racks without mounting features by using adhesive orother means of mechanically coupling to secure sensor assembly 10 to theequipment rack One such means employs double-sided adhesive tape.

FIG. 9 provides the logical diagram illustrating the processesassociated with manufacturing sensor assembly 10 shown in FIGS. 1through 7. This involves first coupling a common bus to a first portionof a flexible body, such as first panel 28 of flexible body 12 withinFIG. 1. In step 92, addressable sensors are communicatively coupled tothe common bus. Additionally, step 94 couples a memory device, such asthat of memory device 16 of FIGS. 1 through 7, to a common bus such astape wire 18. In step 96, a second portion of the flexible body isfolded onto the common bus. For example, flexible body 12 may be foldedalong the fold line that divides flexible body 12 into first panel 28and second panel 30. In step 98, the common bus is secured to the secondportion of the flexible body. This forms the sensor assembly that hasbeen folded over as shown in FIGS. 3, 4A and 4B. Next, step 99establishes a network connection to the common bus so that a networknode or computer system may receive and interpret data associated withthe addressable sensors.

Sensor assembly 10 shown herein is compatible with “smart cooling”systems and their associated temperature data collection system. Thevarious elements and aspects of a networked environmental monitoringsystem for collecting and using temperature data from a large number ofsensors in a data center are depicted in FIGS. 10 through 11. In thecontext of “smart cooling,” it is necessary to deploy a number ofsensors on the front and rear surfaces of computer equipment racks.Provided in FIG. 10 is an illustration of one embodiment of system 100for collecting temperature data that could incorporate sensor assembly10 disclosed herein. The installation in which the temperaturecollection system is illustrated is a data center, though it will beapparent that the sensor assembly is not limited to use in data centers.The temperature collection system includes central computer system 110,temperature-collection module 120, a plurality of computer racks 150(a .. . n) wherein each of the plurality of computer racks includes aplurality of temperature sensors 130(a . . . n) and a connector board140(a . . . n). The temperature-collection module is coupled to at leastone of the connector boards, and to the central computer system.

The method of collecting temperature data using the system depicted inFIG. 10 involve the steps of coupling a number of sensors to at leastone rack of systems. The number of sensors then interconnects to thecentral computer system or network. The central computer system or anetwork node then collects temperature data from each of the pluralityof sensors, and controls the data center cooling system in accordancewith that temperature information. Another implementation may utilize amicrocontroller serving as a network node and mounted within eachequipment or computer rack to serve the sensors data to the network viaan Ethernet connection.

Computer system 110 may be any of a variety of different types, such asa notebook computer, a desktop computer, an industrial personalcomputer, an embedded computer, network node, etc. Computer system 110includes a processing module and various other components such as a userinterface (e.g. keyboard, mouse, voice recognition system, etc.), and anoutput device (e.g. a computer monitor, a television screen, a printer,etc.), depending upon the desired functions of the computer system. Acommunications port can also be coupled to the processor to enable thecomputer system to communicate with an external device or system, suchas a printer, another computer, or a network. The processing module maybe a single processing device or a plurality of processing devices. Sucha processing device may be a microprocessor, micro-controller, digitalsignal processor, microcomputer, central processing unit, fieldprogrammable gate array, programmable logic device, state machine, logiccircuitry, analog circuitry, digital circuitry, and/or any device thatmanipulates signals (analog and/or digital) based on operationalinstructions. Note that when the processing module implements one ormore of its functions via a state machine, analog circuitry, digitalcircuitry, and/or logic circuitry, memory storing the correspondingoperational instructions may be embedded within, or external to, thecircuitry comprising the state machine, analog circuitry, digitalcircuitry, and/or logic circuitry.

Computer system 110 may also be utilized in conjunction with adistributed computing environment where tasks are performed by remoteprocessing devices that are linked through a communications network.Examples of such distributed computing environments include local areanetworks of an office, enterprise-wide computer networks, and theInternet. Additionally, the networks could communicate via wirelessmeans or any of a variety of communication means.

Each of the plurality of computer racks 150(a . . . n) of FIG. 6includes a plurality of temperature sensors 130(a . . . n). Since thetemperature profile of air throughout the system 100 is typicallynon-uniform, multiple sensors are implemented to capture temperaturedata at multiple points. In order to get an accurate profile oftemperature or other conditions, any number of sensors can be deployedon or near each computer rack. In the configuration shown in FIG. 10,each rack in the data center is shown having 3 sensors on the front and3 sensors on the rear of the rack case, with two additional overheadsensors disposed above the body of the rack. Other configurations mayutilize any number of sensors. For example 5 sensors on the front and 5sensors in the back may be employed without an overhead sensor. Thesesensors provide inputs into the control algorithms employed by “smartcooling” to manage the environment within the datacenter. However, otherconfigurations can also be used. For example, the front sensor assemblyshown in FIG. 7 includes three sensors on the center of the door of therack, with no overhead sensors. The rear sensor assembly shown in FIG. 8includes six sensors disposed inside the rear door of the rack, with anadditional overhead sensor disposed above the rack. Other configurationsare also possible.

Each sensor assembly 10 includes a connector wire 34 with a connector 20at its end. Associated with each computer rack 60 is a connector board80, like connector board 140 shown in FIG. 10. The connector wire fromeach sensor assembly connects to the connector board associated with therack. In one simple configuration, the connector board needs no powerand serves as a connection point for each of the plurality of sensors,and as a means for transmitting collected temperature data to thetemperature collection module. FIG. 11 shows an example of a connectorboard and connection scheme that can be utilized in conjunction withvarious embodiments of the sensor assembly. The connector board includesat least two input ports 82. These first input ports are configured toconnect, via connector 20, to a ground line and a data line associatedwith connector wire 34.

In one embodiment, input ports 82 can be RJ-11 phone line type ports orany of a variety of types of ports. As an operative example, data port82A can be configured to connect connector board 80 to temperaturecollection module 110 or directly to central computer system 120, whiledata port 82B can be configured to connect to sensor assembly 10, tocollect temperature data from the plurality of sensors 14. Additionally,data port 82A can be configured to connect the connector board toanother connector board associated with another rack, thereby enablingmultiple connector boards to be connected to a central computer systemin a daisy chain fashion, like that shown in FIG. 10.

Data port 82C can also be provided to connect to a second sensorassembly (not shown) that can be associated with the rack. This sort ofconfiguration is suggested by FIGS. 7 and 8. As shown in FIG. 7,connector wire 34 from the front sensor assembly is connected to theconnector board. Likewise, a connector wire from the rear sensorassembly also extends to a connection point with the connector board.Consequently, a third or more additional input ports will be needed toprovide connectivity to the interconnecting lines 84 that interconnectcomputer rack 60 to the central computer, network node, and/or otherracks.

In the connection scheme shown in FIG. 11, the data leads and groundleads of temperature sensors 14 are coupled in parallel to the first andsecond RJ11 ports 82A, 82B via conductors 36 and 38. Memory device 16 isalso connected to the data and ground lines at the head of the line ofsensors. As a result, the plurality of sensors is connected in parallelto temperature collection module 120 via the data line and the groundline. This concept is advantageous with respect to conventionalmethodology in that conventional methodology suggests a point-to-pointconnection from each sensor to a central data collection system. Byemploying the above-described concepts, multiple temperature sensors arecoupled to a central data collection system (the temperature collectionmodule) via the data line and the ground line. This is substantiallymore efficient than conventional methodology, and allows the temperaturesensors to be installed during production and connected together in thefield.

Returning to FIG. 10, temperature collection module 120 couples tocentral computer system 110 or network node and at least one of theconnector boards 140(a . . . n). The temperature collection module canbe included in the central computer system or network node or can beconfigured in a device separate from the central computer system. Inaccordance with an embodiment, the temperature collection modulecollects temperature data from each plurality of temperature sensors130(a . . . n). The temperature collection module includes connectorboard interface electronics, temperature collection logic, and centralcomputer system interface electronics. The connector board interfaceelectronics are coupled to the temperature collection logic wherein thetemperature collection logic is further coupled to the central computersystem interface electronics. The temperature collection logic isfurther coupled to a temperature data table that maintains the readingsof the sensors. One of ordinary skill in the art will readily recognizethe elements and features of the temperature collection module can beconfigured in a variety of ways.

The temperature collection logic periodically queries the data tablewhich contains the temperature readings of each plurality of thesensors. In order to access individual sensors it is necessary to knowthe address identifier of each of the individual sensors along with thephysical location. This issue is complicated by the fact that theindividual sensors are factory programmed with unique addressinformation that is not re-programmable. However, this problem is solvedby the memory device associated with each sensor assembly. The memorydevice stores the identifier of each sensor on the sensor assembly. Thememory devices are programmed during the assembly of the sensorassembly. Data is stored in the memory device that indicates a uniqueidentifying number for the sensor assembly itself. Also stored in thememory are the unique 1-wire addresses of each sensor device installedon the sensor assembly. These addresses are stored in a table in thesame order as the physical order of the devices on the sensor assembly.It would also be possible to associate the sensor assembly with aparticular rack if it was installed on this rack at the factory.Alternatively the rack information could be programmed in the fieldusing a simple tool designed for this purpose. Using this information,it is possible for a temperature collection module to automaticallyconfigure its data collection logic when a sensor assembly is added toits 1-wire network.

In accordance with one method of collecting temperature data, atemperature data acquisition process can begin with the periodicquerying of each of the sensors in the data center, providing a “start”command whereby the process of taking temperature readings from theindividual sensors is initiated. Currently, this process takesapproximately ¾ to one second per sensor when using the parasiticallypowered sensor devices described above. If faster results are desired,sensors are available with a separate power supply pin for a much fasterresponse. This would be one configuration in which three conductors inthe sensor assembly and in the connecting wire would be needed.

Once the temperature is measured from each sensor, temperaturecollection logic stores the temperature readings in a data table andgenerates a temperature profile of the data center based on thetemperature readings. Separate temperature tables can be generated basedon the varying locations of sensors. For example, based on the locationof the sensors temperature profiles can be generated for the front ofthe rack, the back of the rack, etc.

In varying embodiments, the data center could employ more than onetemperature collection module. In this case, the data table in eachmodule will only contain part of the temperature profile of the datacenter. Accordingly, the central computer can assemble partial profilesof the data center. These partial profiles can subsequently be combinedto form a global temperature profile of the data center.

The method of obtaining temperature data from an installation of sensorsis generally as follows. A first step includes periodically querying ofeach of the sensors in the data center. A second step includes providingan initiation command. A third step includes reading the measuredtemperature of each of the sensors. A final step involves generating atemperature profile of the data center based on the temperaturereadings. The temperature profile can include a variety of profilesbased on the locations of the sensors, and can be presented in a3-dimensional matrix view format. The above-described method may beimplemented, for example, by operating a computer system to execute asequence of machine-readable instructions. The instructions may residein various types of computer readable media.

The sensor assembly substantially addresses the manufacturing andinstallation requirements for networked environmental sensors. Thesensor assembly provides a system for deploying a widely distributedsensor network with simple parallel wiring. The labor-intensive andcostly installation process of traditional temperature measurement isreplaced by an unobtrusive, easily installed assembly. Separatespecialized electrical connections are replaced by a single parallelcircuit of standard telecommunications-grade wiring. Advantageously, thesensor assembly provides broad sensor coverage in an easily installedpackage. The sensor assembly can be produced at a low cost, and iseasily manufactured using existing assembly techniques.

Cost effective networks of digital sensors have many advantages overtraditional sensor systems. Systems sometimes referred to as “smartcooling” systems, developed to provide a networked environmentalmonitor, typically utilize a number of temperature sensors, and locatedat various locations throughout a data center, to dynamically collecttemperature data at various locations within the data center. Bydynamically collecting temperature data at various locations within thedata center, the cooling resources of the data center can be allocatedbased on the actual cooling requirements of the data center. As aresult, substantial savings in operational costs related to theoperation of the data center cooling resources is possible.

As one of average skill in the art will appreciate, the term“substantially” or “approximately”, as may be used herein, provides anindustry-accepted tolerance to its corresponding term. Such anindustry-accepted tolerance ranges from less than one percent to twentypercent and corresponds to, but is not limited to, component values,integrated circuit process variations, temperature variations, rise andfall times, and/or thermal noise. As one of average skill in the artwill further appreciate, the term “operably coupled”, as may be usedherein, includes direct coupling and indirect coupling via anothercomponent, element, circuit, or module where, for indirect coupling, theintervening component, element, circuit, or module does not modify theinformation of a signal but may adjust its current level, voltage level,and/or power level. As one of average skill in the art will alsoappreciate, inferred coupling (i.e., where one element is coupled toanother element by inference) includes direct and indirect couplingbetween two elements in the same manner as “operably coupled”. As one ofaverage skill in the art will further appreciate, the term “comparesfavorably”, as may be used herein, indicates that a comparison betweentwo or more elements, items, signals, etc., provides a desiredrelationship. For example, when the desired relationship is that signal1 has a greater magnitude than signal 2, a favorable comparison may beachieved when the magnitude of signal 1 is greater than that of signal 2or when the magnitude of signal 2 is less than that of signal 1.

Although the application and use of the sensor assembly is disclosed inthe context of a data center, one of ordinary skill in the art willreadily recognize that the functionality of the varying embodiments ofthe sensor assembly can be utilized in a variety of differentfacilities. Specifically, this type of sensor assembly is by no meanslimited to data center applications, and is not limited to temperaturesensing.

It is to be understood that the above-referenced arrangements areillustrative of the application of the principles of the presentinvention. It will be apparent to those of ordinary skill in the artthat numerous modifications can be made without departing from theprinciples and concepts of the invention as set forth in the claims.

1. A network sensor assembly comprising: a panel configured for mountingon a surface; a plurality of addressable sensors coupled to the panelthat sense environmental conditions at the surface; a memory device thatstores configuration information associated with the plurality ofaddressable sensors; and a bus communicatively coupled to the pluralityof addressable sensors and the memory device and configured forcommunicatively coupling the network sensor assembly to a network nodefor communicating data associated with the sensed environmentalconditions in a network.
 2. The network sensor assembly according toclaim 1 further comprising: a plurality of protective tabs coupled tothe panel and respectively coupled to the plurality of addressablesensors in a configuration that supports and protects the addressablesensor plurality.
 3. The network sensor assembly according to claim 1further comprising: a plurality of mounting tabs coupled to the panelconfigured to secure the network sensor assembly to the surface.
 4. Thenetwork sensor assembly according to claim 1 further comprising: thepanel comprising a folding panel that folds at a fold line about thebus; a plurality of protective tabs cut from the folding panelpositioned to support and protect the plurality of addressable sensors;and an adhesive coupling the panel to the bus.
 5. The network sensorassembly according to claim 1 wherein the bus comprises a multipleconductor tape wire.
 6. The network sensor assembly according to claim 1wherein the plurality of addressable sensors sense at least oneenvironmental condition selected from the group consisting oftemperature, humidity, air pressure, air velocity, smoke sensors,occupancy sensors, computer rack door condition, sound, and light. 7.The network sensor assembly according to claim 1 further comprising: thenetwork node configured for communicating data associated with thesensed environmental conditions in a network.
 8. The network sensorassembly according to claim 1 further comprising: application softwarethat operates on data received from the network node associated with thesensed environmental conditions in a network, the application softwareconfigured to: periodically query the plurality of addressable sensorsfrom a plurality of network nodes; reading sensed environmentalconditions from the plurality of addressable sensors from the pluralityof network nodes; and generating an environmental profile of a datacenter based on the sensed environmental conditions.
 9. A method offabricating a network sensor assembly comprising: mechanically couplinga bus to a panel configured for mounting on a surface; mechanicallycoupling a plurality of addressable sensors to the panel;communicatively coupling the bus to the plurality of addressable sensorsthat sense environmental conditions at the surface; communicativelycoupling the bus to a memory device that stores configurationinformation associated with the plurality of addressable sensors; andcommunicatively coupling the memory device and the plurality ofaddressable sensors to a network node for communicating data associatedwith the sensed environmental conditions in a network.
 10. The methodaccording to claim 9 further comprising: coupling a plurality ofprotective tabs to the panel and respectively to the plurality ofaddressable sensors; and configuring the protective tab plurality tosupport and protect the addressable sensor plurality.
 11. The methodaccording to claim 9 further comprising: coupling a plurality ofmounting tabs to the panel; and configuring the mounting tab pluralityto secure the network sensor assembly to the surface.
 12. The methodaccording to claim 9 further comprising: configuring the panel as afolding panel that folds at a fold line about the bus; cutting aplurality of protective tabs from the folding panel; positioning theprotective tab plurality to support and protect the plurality ofaddressable sensors; and coupling the panel to the bus with adhesive.13. A network environmental monitor comprising: at least one networksensor assembly comprising: a panel configured for mounting on asurface; a plurality of addressable sensors coupled to the panel thatsense environmental conditions at the surface; a memory device thatstores configuration information associated with the plurality ofaddressable sensors; and a bus communicatively coupled to the pluralityof addressable sensors and the memory device, the bus configured forcommunicating data associated with the sensed environmental conditions;and at least one network node communicatively coupled to the at leastone network sensor assembly wherein the bus communicatively couples theat least one network sensor assembly to the at least one network nodeand the at least one network node distributes data associated with thesensed environmental conditions over a network; and a processorcommunicatively coupled to the at least one networked node configured toexecute a software application that collects sensed environmentalcondition data from the plurality of addressable sensors and controlsenvironment based on the sensed environmental condition data.
 14. Theenvironmental monitor according to claim 13 further comprising: theprocessor configured to execute a software application that determinessensed environmental conditions at a computer rack and adjustsenvironmental conditions at the computer rack based on the sensedenvironmental conditions at the computer rack.
 15. The environmentalmonitor according to claim 13 further comprising: a plurality ofequipment racks, the plurality of network sensor assemblies respectivelymounted on the equipment rack plurality.
 16. The environmental monitoraccording to claim 15 wherein the equipment rack plurality is containedwithin a data center.
 17. The environmental monitor according to claim16 further comprising: an environmental control system communicativelycoupled to the at least one network node that adjusts environmentalcontrols of the data center based on the sensed environmental conditionsat the plurality of equipment racks.
 18. The environmental monitoraccording to claim 17 wherein the environmental conditions sensedcomprise at least one condition selected from the group consisting oftemperature, humidity, air pressure, air velocity, smoke sensors,occupancy sensors, computer rack door condition, sound, and light. 19.The environmental monitor according to claim 13 wherein the at least onenetwork sensor assembly further comprises: a plurality of protectivetabs coupled to the panel and respectively coupled to the plurality ofaddressable sensors in a configuration that supports and protects theaddressable sensor plurality.
 20. The environmental monitor according toclaim 13 further comprising: application software executable on theprocessor that operates on data received from the network nodeassociated with the sensed environmental conditions in a network, theapplication software configured to: periodically query the plurality ofaddressable sensors from a plurality of network nodes; reading sensedenvironmental conditions from the plurality of addressable sensors fromthe plurality of network nodes; and generating an environmental profileof a data center based on the sensed environmental conditions.